Nexperia joins ESI Partner Board

As of 1 January 2020 Nexperia has become member of the Partner Board of ESI (TNO) and thus joins key High Tech industry players and leading academic institutions based in the Netherlands.

Nexperia and TNO signing

Left: Henk-Jan Vink, TNO: Managing Director TNO Information and Communication Technology.
Right: Paul van den Broek, Director Development, Nexperia.

Since January 2020 Nexperia has become member of the ESI Partner Board. Nexperia thus joins the group of ESI partners, all leading high-tech industrial companies and universities with a base in the Netherlands. ESI director Wouter Leibbrandt: “Joining Nexperia to the ESI Partner Board means a further strengthening of the ESI ecosystem. We see Nexperia’s participation as a recognition of the fact that the methodologies developed by ESI are relevant to more and more high-tech companies."

With the growing complexity of physical systems, the complexity of the embedded systems increases. ESI develops methodologies and tooling for the development of complex systems by the high-tech industry. These methodologies are tested and validated in practice on site at the partners ("industry as lab" concept). The latest insights from universities are applied.

Paul van den Broek, Nexperia: “In 2019 we delivered nearly 100 billion chips. We produce the fastest and most accurate machines in the world. Where ASML is at the front end of the chip machines, Nexperia is at the back end. We are now the number 1 in the world. We really want to maintain this position. With our entry into the ESI ecosystem, we are joining the next generation of machine software. We invest in the quality of the software, and at the same time we remain critical about the costs. With our access to the ESI Partner Board, we invest in our future and contribute to the competitive position of the Netherlands in the machine industry.”

ESI partnerboard

The ESI Partner Board consists of ASML, Nexperia, Canon Production Printing (Océ Technologies - not present on the picture), Philips, Thermo Fisher Scientific, Thales, Delft University of Technology, Eindhoven University of Technology, Radboud University, Twente University and TNO. ESI started in 2001 as a Public Private Partnership, with the cooperation of the Ministry of Economic Affairs. ESI has been part of TNO since 2013.

 


Nexperia

Nexperia is the expert in high-volume production of discrete and MOSFET components and analog & logic ICs that meet the stringent standards set by the Automotive industry. With an absolute focus on efficiency, Nexperia consistently produces the essential semiconductors required by every electronic design in the world: more than 90 billion annually. Products that are benchmarks in efficiency - in process, size, power and performance - with industry-leading small packages that save valuable energy and space.
With decades of experience, supplying to the world’s biggest companies, Nexperia has over 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and OHSAS 18001.
Nexperia: Efficiency wins.

Read more

 

Latest news

MasCot: four projects selected

Four insightful and innovative research projects will start in the Partnership Mastering Complexity (MasCot). NWO and ESI (TNO) fund research in the next generation of engineering methodologies.

ESI helps Thermo Fisher and Philips grease their software machines

When new feature development for its electron microscopes started to get hampered by older software, Thermo Fisher Scientific called on TNO joint innovation center ESI to clean up its code and make it future-proof. The approach developed in their public-private partnership was also successfully adopted by Philips to tackle the legacy challenge in its medical scanners. Source: Bits and Chips

Envision it: new TNO campaign

What seemed impossible yesterday, is a matter of course today. But what is progress? How can innovation make a difference to tomorrow? The goal of the new 'Envision it' campaign is to make TNO known and loved as 'impactful', 'resourceful' and 'innovative', while maintaining our reliable image. Our new corporate campaign therefore focuses on the impact of our innovations.

Benny Åkesson, professor by special appointment of Design Methodologies for Cyber-Physical Systems UvA

Dr B. Åkesson has been appointed professor by special appointment of Design Methodologies for Cyber-Physical Systems on the Faculty of Science at University of Amsterdam (UvA).

Vacancies

  • Scientific Programmer

    (full-time 32-40 hrs), see TNO vacancies

  • Research fellow Model Inference on Software behaviour

    (full-time 32-40 hrs), see vacancy
  • Research Fellow System Performance Analysis

    (full-time 32-40 hrs), see TNO vacancies

Student assignments

- ADA Software Model Checking pdf

- Digital twin for Virtual V&V pdf

- Graduation project: Transfer learning in Bayesian belief networks pdf

- Graduation project: Interactive model structure learning in high-tech systems pdf

TNO offers you the chance to do groundbreaking work and help customers with innovative, practical and smart solutions. And all that with an attractive benefits package. Read more

For more TNO vacancies link

Latest publications

  • Tjerk Bijlsma, Wouter Tabingh Suermondt, Richard Doornbos: A knowledge domain structure to enable system wide reasoning and decision making.
    Proceedings 17th Annual Conference on Systems Engineering Research (CSER) link
  • Vasenev, A., Stahl, F. Hamazaryan, H., Ma, Z., Shan, L., Kemmerich, J., Loiseaux, C.: Practical security and privacy threat analysis in the automotive domain: Long term support scenario for over-the-air updates.
    VEHITS 2019 - Proceedings of the 5th International Conference on Vehicle Technology and Intelligent Transport Systems, 5th International Conference on Vehicle Technology and Intelligent Transport Systems, VEHITS 2019, 3 May 2019 through 5 May 2019 link
  • Jeroen Voeten: Digital twinning, Analysing millions of lines of code in an afternoon.
    Artemis Magazine 26, pages 22-23

overview publications

leaflets